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Julie L. P. Jessop

julie-jessop@uiowa.edu

Photo of Julie JessopAssistant Professor
Chemical and Biochemical Engineering

Researcher
NSF I/UCRC Photopolymerization Center

Researcher
Optical Science and Technology Center

4130 Seamans Center for the Engineering Arts and Sciences
The University of Iowa
Iowa City, IA 52242-1527
Telephone: (319) 335-0681

Complete Curriculum Vitae (PDF File)

Joined the College of Engineering: 2000 

Education: Ph.D., Chemical Engineering, Michigan State University, 1999
B.S., Chemical Engineering, Michigan State University, 1994

Special Fields of Knowledge: Polymers, spectroscopy, microlithography.

Present Research Interests: Spectroscopic characterization of polymer reactions; dental composites; hybrid photopolymer resins; cationic ring-opening photopolymerizations; polymers from renewable resources; chemically amplified photoresists.

Selected Publications: 

  • Y. Cai, J.L.P. Jessop, “Decreased Oxygen Inhibition in Photopolymerized Acrylate/Epoxide Hybrid Polymer Coatings as Demonstrated by Raman Spectroscopy,” Polymer, Vol. 47(19), p. 6560-6566 (2006).
  • C. Comer, J.L.P. Jessop, “Photoinitiated Emulsion Graft Polymerization of Synthetic Monomers to Starch,” RadTech 2006 e|5 Technology Conference Proceedings (2006).
  • D. Kim, J.L.P. Jessop, “The role of water in photoinitiated cationic ring-opening photopolymerization of cyclohexane epoxides,” RadTech 2006 e|5 Technology Conference Proceedings (2006).
  • Y. Zou, S.R. Armstrong, J.L.P. Jessop, "Determination of Adhesive Distribution in Dentin-Adhesive Bond Using Raman Microscopy," Polymer Preprints, 45(2), 327-328, (2004).
  • J.L.P. Jessop, S.N. Goldie, A.B. Scranton, G.J. Blanchard, "Spectroscopic Characterization of Acid Generation and Concentration and Free Volume in 248-nm Chemically Amplified Resists," J. Vac. Sci. Tecnol. B, 20(1), p. 219-225 (2002).

Active Scientific and Professional Society Memberships: American Chemical Society; American Institute of Chemical Engineering; American Society for Engineering Education; Omega Chi Epsilon; RadTech International North America; Tau Beta Pi.

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